Advances and Innovations in electronics in the Chips Acts era
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Special Event Advances and Innovations in electronics in the Chips Acts era
September 22 |
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| September 22 | |||||||||||||
| 09:00 - 10:30 Emerging and advanced techologies in Electronics - Part 1 SE.II.1 - TT.V.G |
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| Co-organized with Sapienza University of Rome Chair: Roberto BEZ, Micron |
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| SE.II.1.1 TT.V.G.1 |
Alessio PANTELLINI Leonardo GaN 0.25um technology performances and reliability needs at Leonardo |
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| SE.II.1.2 TT.V.G.2 |
Paolo FANTINI Micron Memory Technology Enabling the Future Computing Systems |
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| SE.II.1.3 TT.V.G.3 |
Paola TIBERTO INRIM & Italian Association of Magnetism, President Spintronics for energy efficient magnetoelectronics |
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| SE.II.1.4 TT.V.G.4 |
Adriano DIAZ FATTORINI CNR-IMM Thermal stability of Ge-rich GexSb2Te5 layers |
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| SE.II.1.5 TT.V.G.5 |
Paolo TESSARIOL Micron Innovations and future trends in the NAND Flash technology |
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| 11:30 - 13:00 IPCEI Microelectronics initiative: Tech solutions for the digital transformation, IoT and Industry 4.0 SE.II.2 - TT.VI.F |
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| Co-organized with AIRI, FBK and STMicroelectronics Chairs: Andrea PORCARI, AIRI & Cosimo MUSCA, STMicroelectronics |
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| SE.II.2.1 TT.VI.F.1 |
Introduction Andrea PORCARI, Airi Cosimo MUSCA, STMicroelectronics Introduction: an overview of IPCEI goals, achievements, and way forward |
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| SE.II.2.2 TT.VI.F.2 |
Josef-Anton MOSER Infineon Technologies Austria AG, Austria Energy efficient Si and SiC based solutions for e-mobility |
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| SE.II.2.3 TT.VI.F.3 |
Hannes VORABERGER AT&S Austria Technologie & Systemtechnik AG, Austria IPCEI ME 1 in implementation – AT&S results, experiences and impacts |
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| SE.II.2.4 TT.VI.F.4 |
Giovanni PATERNOSTER FBK Recent updates on 3D integration approaches for Silicon Photomultipliers (SiPM) |
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| SE.II.2.5 TT.VI.F.5 |
Bertrand MIENVILLE STMicroelectronics, France Advanced Optical Sensors & Applications |
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| SE.II.2.6 TT.VI.F.6 |
Models and experiences to spill-over technologies to industry and territories Niko HERAKOVIČ University of Ljubljana, Slovenia SMART Factory demo Center – AI: Testing and Experimental Facility for the Manufacturing Sect Petar LAUŠEVIĆ Centre for the Promotion of Science (CPN), Serbia CPN cooperation and outreach activities |
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| 14:00 - 15:30 Industrial strategies and research policies toward Electronics Technology SE.II.3 - TT.VII.G |
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| Co-organized with Sapienza University of Rome Chair: Marco Balucani, Sapienza |
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| SE.II.3.1 TT.VII.G.1 | Claudio LANZIERI Leonardo Leonardo GaAs/GaN Foundry a National strategic asset toward the technology independent |
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| SE.II.3.2 TT.VII.G.2 | Steve BROWN - CV Director ESI Automotive, Stellantis Electronic Materials Innovations for Sustainable Assembly |
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| SE.II.3.3 TT.VII.G.3 | Special interview with Prof. Francesco PRIOLO, University of Catania, Rector Hosted by Chiara LICO, Journalist The impact of PNRR on research fundings and the relationships among the research ecosystems, infrastructures and business world |
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| 16:00 - 17:30 Emerging and advanced techologies in Electronics - Part 2 SE.II.4 - TT.VIII.G |
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| Co-organized with Sapienza University of Rome Chair: Vittorio MORANDI, IMM-CNR |
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| SE.II.4.1 TT.VIII.G.1 |
Roberto MANTOVAN - CV, CNR-IMM |
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| SE.II.4.2 TT.VIII.G.2 |
Andrzej SIKORA Wrocław University of Science and Technology, Poland Diagnostics of microelectronic devices with scanning probe microscopy methods: problems and solutions |
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| SE.II.4.3 TT.VIII.G.3 |
Vincenzo VINCIGUERRA STMicroelectronics Modelling the Elastic Energy of a Bifurcated Wafer: A Benchmark of the Analytical Solution vs. the ANSYS Finite Element Analysis |
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| SE.II.4.4 TT.VIII.G.4 |
Alessio URBANI Micron 3D-NAND cell challenges to enable high density and high-performance devices |
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| SE.II.4.5 TT.VIII.G.5 |
Raffaella CALARCO CNR-IMM Boosting automotive applications with phase change alloys and heterostructures |
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| SE.II.4.6 TT.VIII.G.6 |
Ivana ZRINKSI Institute of Chemical Technology of Inorganic Materials, Johannes Kepler University, Austria Resistive switching in tantalum and hafnium nanoscale anodic oxide devices |
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